器件名称TI

热搜:

产品TMP302TI
描述

TMP302 是一款采用微封装 (SOT563) 的温度开关。TMP302 可通过引脚来选择跳闸点和滞回温度,因而具有低功耗(最大 15µA)且简单易用。

操作查看详情点击下载购买

目录

01450123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ
制造商型号分类描述下载
Mill-Max

Mill-Max

0145-0-15-01-30...机电产品硬件circuit board hardware - pcb 200u sn/pb over NI 30 con
Mill-Max

Mill-Max

0145-0-15-80-30...机电产品硬件circuit board hardware - pcb 200u SN over NI 30 con
Mill-Max

Mill-Max

0145-0-15-01-30...机电产品硬件circuit board hardware - pcb 200u sn/pb over NI 30 con
Mill-Max

Mill-Max

0145-0-15-15-30...机电产品硬件circuit board hardware - pcb 10u AU over NI 30 con
Mill-Max

Mill-Max

0145-0-15-80-30...机电产品硬件circuit board hardware - pcb 200u SN over NI 30 con